Semiconductor Packaging Materials with Halocarbon Electronics Solutions

With over a decade of experience, Halocarbon Electronics Solutions continues to accelerate the development of next-generation semiconductor packaging materials. By working closely with our partners, we leverage industry-wide expertise and resources to meet increasingly stringent requirements, overcoming the challenges and previously perceived limitations of the semiconductor fabrication industry. The critical role of Halocarbon Electronics Solutions

August 5, 2020

Photosensitive Polyimides – Critical for Advanced Semiconductor Packaging

By Jason Spruell Semiconductor Packaging is driving the More than Moore revolution and accelerating the development of ever-powerful electronics. In previous articles, we discussed how advanced polyimides are enabling this More than Moore revolution. Critical to these technologies are photosensitive polyimides.  Polyimides are used as redistribution layer (RDL) dielectrics in the most advanced semiconductor packaging

June 12, 2020

Advanced Semiconductor Polyimides Enabling More than Moore

By Jason Spruell Innovative technologies are driving advances in the semiconductor packaging industry resulting in exponential growth of the number input/outputs (I/Os), modular designs for greater economies of scale, thinner and smaller chip packages. The key packaging technology is known as Fan-Out Wafer Level Packaging (FOWLP) in which the input/outputs (I/O) are “fanned-out” from the

June 4, 2020

More than Moore through Advanced Semiconductor Packaging

By Jason Spruell For over 55 years, the semiconductor industry has continued down the path of unrelenting miniaturization as described by Moore’s Law. A majority of this time has been devoted to advancing photolithographic processes to create ever-decreasing feature sizes on logic processors and memory chips. From i-line and 248 nm, to 193 and 193

May 29, 2020

TFAA: A Semiconductor Solution With Significant Clean-Time Reduction Savings

With growing concerns surrounding the global warming emissions related to semiconductor manufacturing, the electronics industry faces a unique challenge. The demand for more environmentally friendly practices has driven the development of alternatives to traditional materials for use in the removal and cleaning of dielectric films and metal contaminants on the surface of semiconductor wafers. The

May 1, 2020

Upgrading Polyimides Through Enhanced Process Technology

By: Jason Spruell Polyimides as a Versatile Platform Polyimides are an important class of polymeric materials that are used in a wide variety of applications ranging from filtration membranes and aerospace composites electronics-grade coatings and adhesives. Polyimides are known to have excellent chemical resistance, mechanical properties, and high temperature performance. For this reason, polyimides are

April 23, 2020

Halocarbon Electronics Solutions Fluorochemistry Drives Technology for Flexible Displays

Flexible displays are entering the markets at an accelerating rate. These displays are revolutionizing user experience through high-performance organic light-emitting diodes (OLEDs) with the ability to bend and fold to enable significant advancement in the touchscreen industries, including smartphones, tablets, laptop computers, B2B displays, televisions, and more.  Flexible displays offer a unique experience and novel

March 20, 2020

Semiconductor Fabrication: How Are They Manufactured?

Halocarbon engineers and scientists have been working with the leading suppliers in the semiconductor fabrication industry for over a decade. Through next-generation innovation in fluorochemistry, HES has facilitated tremendous progress in the miniaturization of sophisticated semiconductor devices. Understanding the basics of semiconductor fabrication has allowed HES to advance the industry through enhancements in several phases

October 2, 2019

Immersion Photolithography and Semiconductor Miniaturization

Photolithography is a microfabrication process that uses light to etch geometric patterns onto a substrate – most often, a silicon wafer. This method inscribes the extremely small patterns of circuits which form the transistors and capacitors powering our electronic devices. Advances in photolithography have played a significant role in the miniaturization of next-generation electronics. As

September 6, 2019

Emerging Trends in the Semiconductor Industry

As technological advancements continue to improve the design complexity and capability of semiconductor instruments, engineers must deliver specially formulated solutions that meet the evolving demands of the industry. With powerful breakthroughs in the hexafluoroisopropyl (HFIP) chemistry field, Halocarbon Electronic Solutions (HES) leads the market in developing new solutions to improve the performance of semiconductor devices.

June 10, 2019