Halocarbon Electronics Solutions: Bridging the Gap Between Lab-Supply Houses and Large-Scale Chemical Production

As the Lithium-ion (Li-ion) battery industry for the automotive market continues to expand at a rapid pace, the field of innovation becomes increasingly competitive. A market with this magnitude of growth potential and demand presents tremendous opportunities for technology companies of all sizes. Cutting-edge battery technologies have emerged and have been shown to address the

Halocarbon’s Lithium Ion Battery Chemicals Enable Performance Improvements in Lithium Polymer Batteries (LiPo)

Lithium Ion Batteries (LIBs) have become ubiquitous in our daily lives. New battery designs and technologies continue to evolve to meet the ever-increasing needs for mobile energy storage, continuing to provide higher energy densities and improve safety.  Likewise, for applications where weight and size are the most critical factors, Lithium Polymer Batteries (LiPo) have emerged as higher energy density alternatives to traditional LIBs. For this reason, LiPos are used in applications such as unmanned aerial vehicles (drones) and miniaturized consumer electronics devices, where the need for prolonged power in between charging must be balanced with a

Seven Reasons to Use Halocarbon 0.8 Oil for Ultra-Low and Low-Temperature Calibration Baths

Seven Reasons to Use Halocarbon 0.8 Oil for Ultra-Low and Low-Temperature Calibration Baths

Ultra-low temperature calibration baths are routine and essential processes for thermometric sensors in a variety of manufacturing industries. These extreme temperatures require dependable and precise properties, and accordingly, Halocarbon 0.8 Oil is the fluid of choice and industry standard for ultra-low calibration baths. This high-quality calibration bath fluid is specifically designed to perform consistently across

Semiconductor Packaging Materials with Halocarbon Electronics Solutions

With over a decade of experience, Halocarbon Electronics Solutions continues to accelerate the development of next-generation semiconductor packaging materials. By working closely with our partners, we leverage industry-wide expertise and resources to meet increasingly stringent requirements, overcoming the challenges and previously perceived limitations of the semiconductor fabrication industry. The critical role of Halocarbon Electronics Solutions

Halocarbon Electronics Solutions Helps Drive Advancements in USA Military Lithium-Ion Battery Technology

For over 70 years, Halocarbon has provided innovative technical solutions to support strategic US military projects and technology. Halocarbon Electronics Solutions continues this tradition with breakthrough advancements in fluorochemistry for Lithium-ion (Li-ion) batteries by facilitating commercial-scale development for today’s most innovative military applications. Our fluorochemical solutions for Li-ion batteries enable high-performance, lightweight, safe, and reliable

Photosensitive Polyimides – Critical for Advanced Semiconductor Packaging

By Jason Spruell Semiconductor Packaging is driving the More than Moore revolution and accelerating the development of ever-powerful electronics. In previous articles, we discussed how advanced polyimides are enabling this More than Moore revolution. Critical to these technologies are photosensitive polyimides.  Polyimides are used as redistribution layer (RDL) dielectrics in the most advanced semiconductor packaging

Halocarbon PCTFE Technology for Low-Molecular Weight Oligomers

Halocarbon PCTFE Technology for Low-Molecular Weight Oligomers

What Are PCTFE Oligomers? PCTFE oligomers are engineered fluids that consist of only a few repeating CTFE monomer units. These low-molecular weight oligomeric materials differ from the high-molecular weight polymeric thermoplastics of CTFE in a number of ways. PCTFE oligomers are fluid in nature, taking on liquid, grease, or wax forms which can be tuned

Advanced Semiconductor Polyimides Enabling More than Moore

By Jason Spruell Innovative technologies are driving advances in the semiconductor packaging industry resulting in exponential growth of the number input/outputs (I/Os), modular designs for greater economies of scale, thinner and smaller chip packages. The key packaging technology is known as Fan-Out Wafer Level Packaging (FOWLP) in which the input/outputs (I/O) are “fanned-out” from the

More than Moore through Advanced Semiconductor Packaging

By Jason Spruell For over 55 years, the semiconductor industry has continued down the path of unrelenting miniaturization as described by Moore’s Law. A majority of this time has been devoted to advancing photolithographic processes to create ever-decreasing feature sizes on logic processors and memory chips. From i-line and 248 nm, to 193 and 193

TFAA: A Semiconductor Solution With Significant Clean-Time Reduction Savings

With growing concerns surrounding the global warming emissions related to semiconductor manufacturing, the electronics industry faces a unique challenge. The demand for more environmentally friendly practices has driven the development of alternatives to traditional materials for use in the removal and cleaning of dielectric films and metal contaminants on the surface of semiconductor wafers. The